KK

Kenji Kobayashi

LI Lintec: 7 patents #1 of 56Top 2%
SC Shin-Etsu Handotai Co.: 2 patents #8 of 58Top 15%
Ngk Spark Plug Co.: 1 patents #50 of 157Top 35%
SC Sanyo Electric Co.: 1 patents #248 of 774Top 35%
SE Seiko Epson: 1 patents #672 of 1,442Top 50%
SI Sumitomo Metal Industries: 1 patents #42 of 102Top 45%
TC Toyoda Gosei Co.: 1 patents #61 of 233Top 30%
IBM: 1 patents #3,726 of 9,568Top 40%
Casio Computer Co.: 1 patents #69 of 207Top 35%
PA Panasonic: 1 patents #1,599 of 4,214Top 40%
NE Nec: 1 patents #221 of 807Top 30%
📍 Kyoto, JP: #2 of 68 inventorsTop 3%
Overall (2011): #826 of 364,097Top 1%
18
Patents 2011

Issued Patents 2011

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
8086734 Method of autonomic representative selection in local area networks Takeshi Kuwahara 2011-12-27
8085450 Image reading apparatus and image reading method 2011-12-27
8082749 Air conditioner Takashi Sekine, Naoki Sakamoto 2011-12-27
8051607 Weather strip and manufacturing method thereof Kurato Okajima, Mitsuhiro Takahara, Masanori Aritake 2011-11-08
8038824 Sheet peeling apparatus and peeling method Takahisa Yoshioka, Takeshi Takano 2011-10-18
8029339 Workpiece double-disc grinding apparatus and workpiece double-disc grinding method Tadahiro Kato 2011-10-04
8020600 Sheet sticking apparatus 2011-09-20
7963710 Label printer Akira Dangami 2011-06-21
7954533 Sheet cutting table Hideaki Nonaka, Yoshiaki Sugishita 2011-06-07
7932187 Method for fabricating a semiconductor device 2011-04-26
7923164 Solid polymer fuel cell Tetsuaki Hirayama, Hideaki Sasaki 2011-04-12
7914353 Spark plug and method for manufacturing the same Makoto Yamaguchi 2011-03-29
7900677 Sheet sticking apparatus Hideaki Nonaka 2011-03-08
7900675 Label printer Akira Dangami 2011-03-08
7896984 Method for manufacturing seamless steel pipe for line pipe Tomohiko Omura, Kunio Kondo, Yuji Arai, Nobuyuki Hisamune 2011-03-01
7898562 Exposing device and image forming apparatus Yoshiyuki Matsuoka, Isao Ebisawa 2011-03-01
7887394 Double-disc grinding machine, static pressure pad, and double-disc grinding method using the same for semiconductor wafer Hiroshi Oishi 2011-02-15
7875144 Transferring device and transferring method 2011-01-25