HF

Hui Feng

IC Inpaq Technology Co.: 1 patents #1 of 2Top 50%
📍 Sichuan, IL: #1 of 1 inventorsTop 100%
Overall (2011): #282,310 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7884462 Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof Liang Wu 2011-02-08