LW

Liang Wu

IC Inpaq Technology Co.: 1 patents #1 of 2Top 50%
📍 Dongguan, CN: #16 of 68 inventorsTop 25%
Overall (2011): #233,548 of 364,097Top 65%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7884462 Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof Hui Feng 2011-02-08