Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080447 | Method of manufacturing semiconductor device including exposing a dicing line on a wafer | — | 2011-12-20 |
| 8012864 | Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal | Haruki Ito | 2011-09-06 |
| 8004077 | Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof | Haruki Ito | 2011-08-23 |
| 7932612 | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board | — | 2011-04-26 |
| 7910498 | Method for manufacturing semiconductor device | Yasuo Yamasaki, Shuichi Tanaka | 2011-03-22 |
| 7888260 | Method of making electronic device | — | 2011-02-15 |
| 7888177 | Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument | — | 2011-02-15 |
| 7871858 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument | — | 2011-01-18 |
| 7868466 | Semiconductor device and method of manufacture thereof, circuit board and electronic instrument | — | 2011-01-11 |
| 7867830 | Manufacturing method for electronic component with sealing film | — | 2011-01-11 |
| 7863529 | Electronic component | — | 2011-01-04 |