Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012864 | Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal | Nobuaki Hashimoto | 2011-09-06 |
| 8004077 | Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof | Nobuaki Hashimoto | 2011-08-23 |
| 7982310 | Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus | — | 2011-07-19 |
| 7888799 | Semiconductor device, circuit substrate, electro-optic device and electronic appliance | Shuichi Tanaka, Yasuhito Aruga, Ryohei Tamura, Michiyoshi Takano | 2011-02-15 |