JL

Juergen Leib

WP Wafer-Level Packaging Portfolio: 1 patents #1 of 4Top 25%
📍 Freising, DE: #11 of 37 inventorsTop 30%
Overall (2011): #254,186 of 364,097Top 70%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8017435 Method for packaging electronic devices and integrated circuits Hidefumi Yamamoto 2011-09-13