HY

Hidefumi Yamamoto

WP Wafer-Level Packaging Portfolio: 1 patents #1 of 4Top 25%
Overall (2011): #284,238 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8017435 Method for packaging electronic devices and integrated circuits Juergen Leib 2011-09-13