Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043974 | Semiconductor wet etchant and method of forming interconnection structure using the same | Jung-Dae Park, Tae-Hyo Choi, Hun-Jung Yi, Kun-Hyung Lee | 2011-10-25 |
| 7902059 | Methods of forming void-free layers in openings of semiconductor substrates | Jung-Hwan Kim, Hun-Hyeoung Leam, Jai-Dong Lee, Young Seok Kim, Ki-Su Na +1 more | 2011-03-08 |