YK

YongHee Kang

SC Stats Chippac: 1 patents #96 of 188Top 55%
Overall (2011): #123,340 of 364,097Top 35%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7897502 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers KiYoun Jang, Sungsoo Kim 2011-03-01