SK

Sungsoo Kim

SC Stats Chippac: 1 patents #96 of 188Top 55%
📍 Suwon-si, CA: #51 of 96 inventorsTop 55%
Overall (2011): #156,708 of 364,097Top 45%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7897502 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers KiYoun Jang, YongHee Kang 2011-03-01