Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039972 | Printed circuit board and method thereof and a solder ball land and method thereof | Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Ho-Geon Song, Jun-Young Ko | 2011-10-18 |
| 7863161 | Method of cutting a wafer | Dae-Sang Chan, Jun-Young Ko, Jae-Yong Park | 2011-01-04 |