Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053351 | Method of forming at least one bonding structure | Hwang-Bok Ryu, Ky-Hyun Jung, Jae-Yong Park | 2011-11-08 |
| 8039972 | Printed circuit board and method thereof and a solder ball land and method thereof | Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Jun-Young Ko | 2011-10-18 |