Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7868443 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Heung-Kyu Kwon, Tae Hun Kim | 2011-01-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7868443 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Heung-Kyu Kwon, Tae Hun Kim | 2011-01-11 |