Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7994643 | Stack package, a method of manufacturing the stack package, and a digital device having the stack package | Tae Hun Kim, Sang-Uk Kim | 2011-08-09 |
| 7928555 | Stack semiconductor package including an interposer chip having an imposed diode or capacitor | Tae Hun Kim | 2011-04-19 |
| 7868443 | Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability | Tae Hun Kim, Su-chang Lee | 2011-01-11 |