Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7948768 | Tape circuit substrate with reduced size of base film | Sang Ho Park, Sa-Yoon Kang | 2011-05-24 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more | 2011-03-29 |
| 7880286 | Tape wiring substrate and chip-on-film package using the same | Eun-Seok Song | 2011-02-01 |