Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7956452 | Flip chip packages | Yun-Seok Choi, Hee-Seok Lee | 2011-06-07 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho, Sang-Heui Lee +6 more | 2011-03-29 |
| 7895742 | Method for manufacturing tape wiring board | Sa-Yoon Kang, Yong-Hwan Kwon, Chung-Sun Lee | 2011-03-01 |
| 7888237 | Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer | Dong-Han Kim, Chul Woo Kim | 2011-02-15 |