Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004091 | Semiconductor package, method of fabricating the same, and semiconductor package mold | Sang Wook Park, Seung Jae Lee, Min Young Son | 2011-08-23 |
SY
Seung Yeol Yang
Overall (2011): #169,464 of 364,097Top 50%
1
Patents 2011