Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022517 | Semiconductor chip package | Sung Hwan Yoon, Sang Wook Park | 2011-09-20 |
| 8004091 | Semiconductor package, method of fabricating the same, and semiconductor package mold | Seung Yeol Yang, Sang Wook Park, Seung Jae Lee | 2011-08-23 |