Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7952199 | Circuit board including solder ball land having hole and semiconductor package having the circuit board | Seung-Kon Mok, Han Shin Youn | 2011-05-31 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more | 2011-03-29 |