Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058735 | Wafer-level chip scale package having stud bump and method for fabricating the same | Yoon-hwa Choi | 2011-11-15 |
| 7942623 | Substrate supporting means having wire and apparatus using the same | Chul Joo HWANG | 2011-05-17 |
| 7907597 | Method and apparatus for providing voice and data services in a mobile communication system with various overlapped access networks | Jin-Man Kim, Tae Won Kim, Hong-Sung Chang, Jae-Jeong Shim, Geun-Hwi Lim +1 more | 2011-03-15 |