Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058735 | Wafer-level chip scale package having stud bump and method for fabricating the same | Sang-Do Lee | 2011-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058735 | Wafer-level chip scale package having stud bump and method for fabricating the same | Sang-Do Lee | 2011-11-15 |