Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058558 | Printed circuit board and manufacturing method thereof | Dong-Jin Park, Jun Heyoung Park, Ki Hwan Kim, Sung Young Kim | 2011-11-15 |
| 7973248 | Printed circuit board using paste bump and manufacturing method thereof | Chang-Sup Ryu, Eung-Suek Lee, Youn-Soo Seo, Hee-Bum Shin, Yoong Oh +3 more | 2011-07-05 |
| 7901985 | Method for manufacturing package on package with cavity | Chang-Sup Ryu, Dong-Jin Park | 2011-03-08 |