HS

Hee-Bum Shin

Samsung: 1 patents #3,826 of 8,673Top 45%
📍 Gunpo-si, KR: #24 of 64 inventorsTop 40%
Overall (2011): #288,496 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7973248 Printed circuit board using paste bump and manufacturing method thereof Jee-Soo Mok, Chang-Sup Ryu, Eung-Suek Lee, Youn-Soo Seo, Yoong Oh +3 more 2011-07-05