Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7998834 | Substrate level bonding method and substrate level package | Chul Soo Kim, Kuk-jin Chun, Sung-chan KANG, Jong-Hyuk Kim, In-sang Song +1 more | 2011-08-16 |
JS
Jae Shik Shin
Overall (2011): #272,979 of 364,097Top 75%
1
Patents 2011