Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7998834 | Substrate level bonding method and substrate level package | Chul Soo Kim, Kuk-jin Chun, Jong-Hyuk Kim, In-sang Song, Duck Hwan Kim +1 more | 2011-08-16 |
| 7928792 | Apparatus for outputting complementary signals using bootstrapping technology | Bai-Sun Kong, Byung Hwa Jung | 2011-04-19 |