Issued Patents 2011
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085549 | Circuit device | Yasutaka Nakashiba | 2011-12-27 |
| 8072073 | Semiconductor device and method of manufacturing same | Katsumi Kikuchi, Shintaro Yamamichi, Kouji Soejima | 2011-12-06 |
| 8058165 | Semiconductor device and method of manufacturing the same | Koji Soejima, Yoichiro Kurita | 2011-11-15 |
| 8035231 | Semiconductor device and method of manufacturing the same | Yoichiro Kurita, Koji Soejima | 2011-10-11 |
| 8035217 | Semiconductor device and method for manufacturing same | Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Takehiko Maeda +1 more | 2011-10-11 |
| 8030201 | Semiconductor device and method of manufacturing the same | Koji Soejima, Yoichiro Kurita, Shintaro Yamamichi, Katsumi Kikuchi | 2011-10-04 |
| 8022529 | Semiconductor device and method for manufacturing the same | — | 2011-09-20 |
| 8008191 | Semiconductor device and method for manufacturing the same | — | 2011-08-30 |
| 7999401 | Semiconductor device and method of manufacturing same | Hideya Murai, Kentaro Mori, Shintaro Yamamichi, Takehiko Maeda, Kouji Soejima | 2011-08-16 |
| 7928001 | Electronic device and method of manufacturing the same | Yoichiro Kurita, Koji Soejima | 2011-04-19 |
| 7927999 | Method of forming metal interconnect layers for flip chip device | Yoichiro Kurita, Koji Soejima | 2011-04-19 |
| 7898073 | Semiconductor device and semiconductor module employing thereof | Satoshi Matsui | 2011-03-01 |
| 7892973 | Method for manufacturing a semiconductor device | Koji Soejima, Nobuaki Takahashi | 2011-02-22 |