Issued Patents 2011
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058165 | Semiconductor device and method of manufacturing the same | Masaya Kawano, Yoichiro Kurita | 2011-11-15 |
| 8050050 | Wiring board, semiconductor device, and method of manufacturing the same | Shintaro Yamamichi, Katsumi Kikuchi, Yoichiro Kurita | 2011-11-01 |
| 8039756 | Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Yoichiro Kurita | 2011-10-18 |
| 8035231 | Semiconductor device and method of manufacturing the same | Yoichiro Kurita, Masaya Kawano | 2011-10-11 |
| 8030201 | Semiconductor device and method of manufacturing the same | Yoichiro Kurita, Masaya Kawano, Shintaro Yamamichi, Katsumi Kikuchi | 2011-10-04 |
| 7928001 | Electronic device and method of manufacturing the same | Yoichiro Kurita, Masaya Kawano | 2011-04-19 |
| 7927999 | Method of forming metal interconnect layers for flip chip device | Yoichiro Kurita, Masaya Kawano | 2011-04-19 |
| 7892973 | Method for manufacturing a semiconductor device | Masaya Kawano, Nobuaki Takahashi | 2011-02-22 |
| 7889514 | Wiring board, semiconductor device, and method of manufacturing the same | Shintaro Yamamichi, Katsumi Kikuchi, Yoichiro Kurita | 2011-02-15 |
| 7880295 | Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Yoichiro Kurita | 2011-02-01 |