Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8050467 | Package, packaging method and substrate thereof for sliding type thin fingerprint sensor | Charles C. Yang, Yeh Chen, Wei-Te Chu, Tun-Yu Chen | 2011-11-01 |
| 7953257 | Sliding type thin fingerprint sensor package | Yeh Chen, Lin Chen, Hua Chen, Heng Liu | 2011-05-31 |