WC

Wei-Te Chu

CT Chipbond Technology: 1 patents #3 of 8Top 40%
Overall (2011): #133,398 of 364,097Top 40%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8050467 Package, packaging method and substrate thereof for sliding type thin fingerprint sensor Charles C. Yang, Yeh Chen, Yung-Jen Chen, Tun-Yu Chen 2011-11-01