Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE42457 | Methods of packaging an integrated circuit and methods of forming an integrated circuit package | Dexin Liang | 2011-06-14 |
| RE42332 | Integrated circuit package, ball-grid array integrated circuit package | Dexin Liang | 2011-05-10 |