Dexin Liang

TSMC: 2 patents #147 of 830Top 20%

📍 Huizhou, CA: #1 of 1 inventorsTop 100%

Overall (2011): #103,916 of 364,097Top 30%

Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
RE42457	Methods of packaging an integrated circuit and methods of forming an integrated circuit package	Lily Zhao	2011-06-14
RE42332	Integrated circuit package, ball-grid array integrated circuit package	Lily Zhao	2011-05-10