Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080869 | Wafer level package structure and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Kouji Gotou, Hisakazu Miyajima +2 more | 2011-12-20 |
| 8067769 | Wafer level package structure, and sensor device obtained from the same package structure | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Kouji Gotou, Hisakazu Miyajima +2 more | 2011-11-29 |
| 8026594 | Sensor device and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Kouji Gotou, Hisakazu Miyajima +2 more | 2011-09-27 |
| 7898160 | Method and apparatus for modifying object with electrons generated from cold cathode electron emitter | Koichi Aizawa, Tsutomu Ichihara, Takuya Komoda, Jyunji Ikeda | 2011-03-01 |