Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080869 | Wafer level package structure and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Hisakazu Miyajima +2 more | 2011-12-20 |
| 8067769 | Wafer level package structure, and sensor device obtained from the same package structure | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Hisakazu Miyajima +2 more | 2011-11-29 |
| 8026594 | Sensor device and production method therefor | Takafumi Okudo, Yuji Suzuki, Yoshiyuki Takegawa, Toru Baba, Hisakazu Miyajima +2 more | 2011-09-27 |