Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7861908 | Component mounting method, component mounting apparatus, and ultrasonic bonding head | Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama +5 more | 2011-01-04 |