Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8001678 | Component mounting apparatus | Akira Kabeshita, Kurayasu Hamasaki, Noriyuki Tani, Yoichi Makino | 2011-08-23 |
| 7938929 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2011-05-10 |
| 7861908 | Component mounting method, component mounting apparatus, and ultrasonic bonding head | Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita +5 more | 2011-01-04 |