Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026181 | Manufacturing method for semiconductor chips | Akira Nakagawa | 2011-09-27 |
| 8012805 | Manufacturing method for semiconductor chips, and semiconductor chip | Akira Nakagawa | 2011-09-06 |
| 7994026 | Plasma dicing apparatus and method of manufacturing semiconductor chips | Atsushi Harikai, Tetsuhiro Iwai | 2011-08-09 |
| 7989803 | Manufacturing method for semiconductor chips and semiconductor wafer | Teruaki Nishinaka | 2011-08-02 |
| 7964449 | Method for manufacturing semiconductor chip and method for processing semiconductor wafer | Hiroshi Haji | 2011-06-21 |
| 7927973 | Method for dividing semiconductor wafer and manufacturing method for semiconductor devices | Hiroshi Haji, Akira Nakagawa, Kazuhiro Noda | 2011-04-19 |
| 7923351 | Manufacturing method of semiconductor devices | — | 2011-04-12 |
| 7906410 | Method of manufacturing semiconductor chip using laser light and plasma dicing | Atsushi Harikai | 2011-03-15 |
| 7871901 | Manufacturing method for semiconductor chips | Akira Nakagawa | 2011-01-18 |