Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043705 | Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material | Toshifumi Kawamura | 2011-10-25 |
| 8004082 | Electronic component formed with barrier-seed layer on base material | Junnosuke Sekiguchi | 2011-08-23 |
| 7968150 | Method of surface treatment using imidazole compound | Atsushi Yabe, Junnosuke Sekiguchi | 2011-06-28 |
| 7867564 | Metal plating method and pretreatment agent | Atsushi Yabe | 2011-01-11 |