Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8004082 | Electronic component formed with barrier-seed layer on base material | Toru Imori | 2011-08-23 |
| 7968150 | Method of surface treatment using imidazole compound | Toru Imori, Atsushi Yabe | 2011-06-28 |
| 7943033 | Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode | Akihiro Aiba, Takeo Okabe | 2011-05-17 |