Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058567 | High density package substrate and method for fabricating the same | Wei-Wen Lan, Ching-Ming Chuang, Shi-Shyan James Shang | 2011-11-15 |
| 7877873 | Method for forming a wire bonding substrate | Hung-En Hsu, Wei-Wen Lan, Yun-Hsiang Pai | 2011-02-01 |