Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058567 | High density package substrate and method for fabricating the same | Meng-Han Lee, Wei-Wen Lan, Ching-Ming Chuang | 2011-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8058567 | High density package substrate and method for fabricating the same | Meng-Han Lee, Wei-Wen Lan, Ching-Ming Chuang | 2011-11-15 |