Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043968 | Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures | Hao Cui, Peter A. Burke | 2011-10-25 |
| 7956401 | Bi-axial texturing of high-K dielectric films to reduce leakage currents | Wai Lo, Sey-Shing Sun | 2011-06-07 |