Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8007166 | Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers | Gabriel M. Kuhn, Howard H. Ge, Daryl K. Sakaida | 2011-08-30 |
| 7973611 | Middle layer of die structure that comprises a cavity that holds an alkali metal | William P. Debley, Christine Geosling, Daryl K. Sakaida, Robert E. Stewart | 2011-07-05 |