Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8083954 | Method for fabricating component-embedded printed circuit board | Chien-Wei Chang, Ting-Hao Lin | 2011-12-27 |
| 7875809 | Method of fabricating board having high density core layer and structure thereof | Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Chia-Chi Lo | 2011-01-25 |
| 7871892 | Method for fabricating buried capacitor structure | Chien-Wei Chang, Ting-Hao Lin, Ya-Hsiang Chen | 2011-01-18 |