CL

Chia-Chi Lo

KT Kinsus Interconnect Technology: 1 patents #4 of 6Top 70%
Overall (2011): #332,521 of 364,097Top 95%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7875809 Method of fabricating board having high density core layer and structure thereof Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu 2011-01-25