Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084332 | Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom | Anthony Flannery | 2011-12-27 |
| 8069726 | X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging | Joseph Seeger, Alexander Castro | 2011-12-06 |
| 8047075 | Vertically integrated 3-axis MEMS accelerometer with electronics | Joseph Seeger, Goksen G. Yaralioglu | 2011-11-01 |
| 7934423 | Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics | Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri | 2011-05-03 |
| 7907838 | Motion sensing and processing on mobile devices | David Sachs | 2011-03-15 |