MH

Michael C. Harmes

IN Intel: 1 patents #830 of 2,663Top 35%
📍 North Plains, OR: #4 of 11 inventorsTop 40%
🗺 Oregon: #995 of 2,981 inventorsTop 35%
Overall (2011): #215,310 of 364,097Top 60%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7973407 Three-dimensional stacked substrate arrangements Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more 2011-07-05