Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7973407 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2011-07-05 |
| 7867891 | Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance | Rohan Akolkar, Tejaswi K. Indukuri, Arnel M. Fajardo | 2011-01-11 |