Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076786 | Semiconductor package and method for packaging a semiconductor package | Chang Ying Hung, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Wei Chi Yih +1 more | 2011-12-13 |
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Wei Chi Yih +3 more | 2011-11-08 |
| 8018075 | Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Wei Chi Yih +1 more | 2011-09-13 |