Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076786 | Semiconductor package and method for packaging a semiconductor package | Chang Ying Hung, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Jian-Cheng Chen, Wei Chi Yih +1 more | 2011-12-13 |
| 8072064 | Semiconductor package and method for making the same | Tsung-Yueh Tsai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng | 2011-12-06 |
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +3 more | 2011-11-08 |
| 8018075 | Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +1 more | 2011-09-13 |
| 7980757 | Bonding strength measuring device | Tsung-Yueh Tsai, Hsiao-Chuan Chang | 2011-07-19 |
| 7964949 | Tenon-and-mortise packaging structure | Tsung-Yueh Tsai, Hsiao-Chuan Chang, Tsan-Hsien Chen | 2011-06-21 |
| 7955897 | Chip structure and stacked chip package as well as method for manufacturing chip structures | Tsung-Yueh Tsai, Cheng-Wei Huang | 2011-06-07 |