Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989948 | Chip package structure and method of fabricating the same | Jui-Ching Hsieh, Pin Chang, Chung-De Chen, Yu-Jen Wang, Chin-Horng Wang | 2011-08-02 |
| 7973454 | Vacuum hermetic organic packaging carrier and sensor device package | Lung-Tai Chen, Tzong-Che Ho, Yu-Wen Fan | 2011-07-05 |